Two material high K thermal encapsulant system

US10475715B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Venmathy McMahan · Phoenix, US
• Sivakumar Nagarajan · Chandler, US
• Elah Bozorg-Grayeli · Chandler, US
• Amrita Mallik · Chandler, US
• Kuang-Han Chu · Chandler, US
• Liwei Wang · Phoenix, US
• Nisha Ananthakrishnan · Chandler, US
• Craig J. Weinman · Mesa, US
• Amram Eitan · Scottsdale, US

Key dates

• Filing date: Jun 17, 2015
• Grant date: Nov 12, 2019
• Expiry date: Jan 21, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/1434
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Some embodiments relate to an electronic package. The electronic package includes a first die and a second die stacked onto the first die. A first encapsulant is positioned between the first die and the second die. The first encapsulant includes a first material that covers a first volume between the first die and the second die. A second encapsulant is positioned between the first die and the second die. The second encapsulant includes a second material that covers a second volume between the first die and the second die. The first material has a higher thermal conductivity than the second material, and the second material more effectively promotes electrical connections between the first die and the second die as compared to the first material.