Andreas Schlögl
3Patents
2h-index
14Co-inventors
41Inventor score
Filing activity: Sep 20, 2001 → Aug 12, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6838729B2 | Semiconductor component with enhanced avalanche ruggedness | Electricity | 20 | Expired |
| US9099454B2 | Molded semiconductor package with backside die metallization | Electricity | 8 | Active |
| US6904128B2 | Device for cooling surface that rotates about a rotation axis and that faces the rotation axis | Human Necessities | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.