Andrej Lenz
2Patents
1h-index
5Co-inventors
30Inventor score
Filing activity: Nov 29, 2004 → Jul 28, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7790569B2 | Production of semiconductor substrates with buried layers by joining (bonding) semiconductor wafers | Electricity | 2 | Active |
| US8449675B2 | Semiconductor wafer with an epitaxially deposited layer, and process for producing the semiconductor wafer | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.