Anthony Meyer
4Patents
4h-index
10Co-inventors
43Inventor score
Filing activity: Apr 26, 1996 → Jul 10, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5722877A | Technique for improving within-wafer non-uniformity of material removal for performing CMP | Performing Operations; Transporting | 109 | Expired |
| US5800248A | Control of chemical-mechanical polishing rate across a substrate surface | Performing Operations; Transporting | 101 | Expired |
| US6086460A | Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization | Performing Operations; Transporting | 30 | Expired |
| US6328637A | Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization | Performing Operations; Transporting | 9 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.