Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization
US6328637A · kind A · utility
9Cited by
25References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2000 |
| Grant date | Dec 11, 2001 |
| Priority date | — |
| Expiry date | Jul 10, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D5/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for conditioning a polishing pad is described. The method includes steps of moving a cylindrical roller having an abrasive substance affixed to it against a moving polishing pad. The roller may be passively rotated by contact with the polishing pad, or actively reciprocated, while maintaining a pressure against the polishing pad. The apparatus includes a cylindrical roller attached to one or more pressure application devices mechanically connected to the roller.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.