Technique for improving within-wafer non-uniformity of material removal for performing CMP
US5722877A · kind A · utility
109Cited by
7References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 11, 1996 |
| Grant date | Mar 3, 1998 |
| Priority date | — |
| Expiry date | Oct 11, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B21/06
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A platen ring for use with a platen on a linear polisher, in which the platen ring is used to reduce fluctuation of the belt/pad assembly as it encounters the platen. The platen ring is disposed around the platen so that a fluctuation of the belt/pad assembly is dampened before the belt/pad assembly engages the platen. Reduction of the belt/pad fluctuation ensures a reduction in the within-wafer non-uniformity and provides for a more uniform polishing rate across the surface of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.