Barry A. Bonitz
4Patents
3h-index
9Co-inventors
43Inventor score
Filing activity: Apr 2, 1993 → Jan 8, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5414928A | Method of making an electronic package assembly with protective encapsulant material | Emerging Cross-Sectional Technologies | 16 | Expired |
| US6545869B2 | Adjusting fillet geometry to couple a heat spreader to a chip carrier | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6984286B2 | Adjusting fillet geometry to couple a heat spreader to a chip carrier | Emerging Cross-Sectional Technologies | 3 | Expired |
| US7094966B2 | Packaging integrated circuits with adhesive posts | Emerging Cross-Sectional Technologies | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.