Packaging integrated circuits with adhesive posts
US7094966B2 · kind B2 · utility
3Cited by
11References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 22, 2002 |
| Grant date | Aug 22, 2006 |
| Priority date | — |
| Expiry date | Aug 5, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49128
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package for an integrated circuit that is attached to a rigid substrate by the flip-chip method has a heat spreader that is attached to the IC by a thermally conductive, compliant adhesive and that is attached to the package substrate by a set of rigid posts of adhesive, the result of which is that the heat spreader is more closely parallel to the substrate than was the case for a stiffener bonded to the substrate by a thin film extending over a large area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.