Ben Mooring
8Patents
5h-index
10Co-inventors
56Inventor score
Filing activity: Jul 15, 1996 → Oct 31, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6312525A | Modular architecture for semiconductor wafer fabrication equipment | Emerging Cross-Sectional Technologies | 614 | Expired |
| US5789878A | Dual plane robot | Emerging Cross-Sectional Technologies | 59 | Expired |
| US6428394B1 | Method and apparatus for chemical mechanical planarization and polishing of semiconductor wafers using a continuous polishing member feed | Performing Operations; Transporting | 47 | Expired |
| US7486878B2 | Offset correction methods and arrangement for positioning and inspecting substrates | Electricity | 16 | Active |
| US7479236B2 | Offset correction techniques for positioning substrates | Emerging Cross-Sectional Technologies | 12 | Active |
| US8135485B2 | Offset correction techniques for positioning substrates within a processing chamber | Electricity | 5 | Active |
| US8328942B2 | Wafer heating and temperature control by backside fluid injection | Electricity | 4 | Active |
| US8591665B2 | Wafer heating and temperature control by backside fluid injection | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.