Encapsulating brittle substrates using transfer molding
US7114939B2 · kind B2 · utility
1Cited by
9References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 20, 2003 |
| Grant date | Oct 3, 2006 |
| Priority date | — |
| Expiry date | May 27, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C70/72
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A transfer molding arrangement for encapsulating a substrate with an encapsulating material comprising a bottom mold and a top mold, wherein a space is provided between the top mold and bottom mold for receiving the substrate, and the top mold and/or the bottom mold is/are arranged in such a way that when a clamping force is applied sufficiently strong, the top mold and bottom mold are abutted against each other, thereby distributing the force exerted on the substrate to the top mold and bottom mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.