Benjamin C. Smedley
2Patents
2h-index
6Co-inventors
30Inventor score
Filing activity: Nov 8, 2011 → Jan 11, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8520222B2 | System and method for in situ monitoring of top wafer thickness in a stack of wafers | Physics | 4 | Active |
| US9393669B2 | Systems and methods of processing substrates | Performing Operations; Transporting | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.