Patent · US Active

System and method for in situ monitoring of top wafer thickness in a stack of wafers

US8520222B2 · kind B2 · utility

4Cited by

0References

2Claims

0Family size

Assignee

Strasbaugh · US

Inventors

Frederic Anthony Schraub · San Luis Obispo, US
Michael Vogtmann · San Ramon, US
Benjamin C. Smedley · San Luis Obispo, US

Key dates

Filing date	Nov 8, 2011
Grant date	Aug 27, 2013
Priority date	—
Expiry date	Nov 16, 2031

Classification

Technology area (CPC G)Physics
CPC primaryG01B11/0683
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A system for holding non-contact wafer probes over the surface of a wafer which includes a system for flushing the surface of the probe during grinding.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.