Systems and methods of processing substrates

US9393669B2 · kind B2 · utility

Assignee

• Strasbaugh · US

Inventors

• William J. Kalenian · San Luis Obispo, US
• Thomas A. Walsh · Atascadero, US
• Michael Vogtmann · San Ramon, US
• Benjamin C. Smedley · San Luis Obispo, US
• Larry Spiegel · San Luis Obispo, US
• Thomas E. Brake · San Luis Obispo, US

Key dates

• Filing date: Jan 11, 2013
• Grant date: Jul 19, 2016
• Expiry date: Jan 17, 2035

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B24B49/04
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

Some embodiments provide methods of processing wafers comprising: positioning a stacked wafer into a position to be ground, wherein the stacked wafer comprises a first wafer secured with a carrier-wafer, wherein the first wafer is secured with the carrier-wafer such that a surface of the first wafer is exposed to be ground; initiating a grinding of the first wafer while supported by the carrier-wafer; activating one or more sensors relative to the first wafer while grinding the first wafer; determining, while grinding the first wafer, a thickness of the first wafer separate from a thickness of the carrier-wafer as a function of data from the one or more sensors; determining whether the determined thickness of the first wafer has a predefined relationship with a first thickness threshold; and halting the wafer grinding when the thickness of the first wafer has the predefined relationship with the first thickness threshold.