Bingchien Wu
3Patents
1h-index
2Co-inventors
27Inventor score
Filing activity: Aug 30, 2021 → Jan 17, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11908843B2 | Semiconductor package, method of bonding workpieces and method of manufacturing semiconductor package | Electricity | 1 | Active |
| US12406970B2 | Semiconductor package and method of bonding workpieces | Electricity | 0 | Active |
| US12381191B2 | Semiconductor package, method of bonding workpieces and method of manufacturing semiconductor package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.