Boe Su
3Patents
3h-index
12Co-inventors
43Inventor score
Filing activity: Jul 22, 2004 → Sep 8, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7633165B2 | Introducing a metal layer between SiN and TiN to improve CBD contact resistance for P-TSV | Electricity | 175 | Active |
| US7122458B2 | Method for fabricating pad redistribution layer | Electricity | 26 | Expired |
| US7187078B2 | Bump structure | Electricity | 8 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.