Method for fabricating pad redistribution layer
US7122458B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2004 |
| Grant date | Oct 17, 2006 |
| Priority date | — |
| Expiry date | Apr 26, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for fabricating a pad redistribution layer. First, at least one bonding pad exposed by a first passivation layer is provided. A diffusion barrier layer and a seed layer are then formed over the first passivation layer and the bonding pad. A patterned mask layer is then formed over the seed layer to expose a portion thereof over the bonding pad, and a metal layer is then formed thereon. A sacrificial layer is then formed over the substrate and the sacrificial layer over the patterned mask layer is removed. The conductive film exposed by the metal layer and the remaining sacrificial layer is then removed, leaving a pad redistribution layer for the bonding pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.