Boyi Yang
10Patents
4h-index
5Co-inventors
49Inventor score
Filing activity: Jul 18, 2011 → Mar 17, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8674440B2 | Power device integration on a common substrate | Electricity | 33 | Active |
| US8994115B2 | Power device integration on a common substrate | Electricity | 20 | Active |
| US8928116B2 | Power device integration on a common substrate | Electricity | 17 | Active |
| US9412881B2 | Power device integration on a common substrate | Electricity | 17 | Active |
| US9825124B2 | Power device integration on a common substrate | Electricity | 4 | Active |
| US8722503B2 | Capacitors and methods of forming | Electricity | 4 | Active |
| US10290702B2 | Power device on bulk substrate | Electricity | 2 | Active |
| US11302775B2 | Power device integration on a common substrate | Electricity | 0 | Active |
| US11791377B2 | Power device integration on a common substrate | Electricity | 0 | Active |
| US10290703B2 | Power device integration on a common substrate | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.