Brigitte Ruehle
6Patents
1h-index
11Co-inventors
37Inventor score
Filing activity: May 19, 2017 → Nov 6, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10461056B2 | Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact | Electricity | 1 | Active |
| US10978418B2 | Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer | Electricity | 1 | Active |
| US10497634B2 | Chip package comprising a chemical compound and a method of forming a chip package comprising a chemical compound | Electricity | 0 | Active |
| US12033972B2 | Chip package, method of forming a chip package and method of forming an electrical contact | Electricity | 0 | Active |
| US10672678B2 | Method for forming a chip package with compounds to improve the durability and performance of metal contact structures in the chip package | Electricity | 0 | Active |
| US9941181B2 | Chip package and method of forming a chip package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.