Patent · US Active

Chip package, method of forming a chip package and method of forming an electrical contact

US12033972B2 · kind B2 · utility

0Cited by

3References

12Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Joachim Mahler · Regensburg, DE
Michael Bauer · Nittendorf, DE
Jochen Dangelmaier · Beratzhausen, DE
Reimund Engl · Munich, DE
Johann Gatterbauer · Parsberg, DE
Frank Hille · Munich, DE
Michael Huettinger · Munich, DE
Werner Kanert · Holzkirchen, DE
Heinrich Koerner · Bruckmühl, DE
Brigitte Ruehle · Holzkirchen, DE
Francisco Javier Santos Rodriguez · Villach, AT
Antonio Vellei · Villach, AT

Key dates

Filing date	Nov 6, 2020
Grant date	Jul 9, 2024
Priority date	—
Expiry date	Mar 31, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of forming an electrical contact is provided. The method may include depositing, by atomic layer deposition, a passivation layer over at least a region of a metal surface, wherein the passivation layer may include aluminum oxide, and electrically contacting the region of the metal surface with a metal contact structure, wherein the metal contact structure may include copper.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.