Bruce Euzent
4Patents
3h-index
7Co-inventors
39Inventor score
Filing activity: Jun 19, 2003 → May 12, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7585702B1 | Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate | Electricity | 29 | Active |
| US7210081B1 | Apparatus and methods for assessing reliability of assemblies using programmable logic devices | Physics | 7 | Expired |
| US7741160B1 | Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate | Electricity | 5 | Active |
| US8212353B1 | Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate | Electricity | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.