Candy Tien
3Patents
3h-index
9Co-inventors
36Inventor score
Filing activity: Oct 12, 1999 → Jun 14, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6246115A | Semiconductor package having a heat sink with an exposed surface | Electricity | 108 | Expired |
| US6552428B1 | Semiconductor package having an exposed heat spreader | Electricity | 84 | Expired |
| US6650015B2 | Cavity-down ball grid array package with semiconductor chip solder ball | Electricity | 7 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.