Cavity-down ball grid array package with semiconductor chip solder ball
US6650015B2 · kind B2 · utility
7Cited by
5References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2002 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | Jun 14, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cavity-down ball grid array package includes a substrate having a through cavity provided therein. A heat sink is attached to the substrate and a semiconductor chip in the cavity is attached to the heat sink and electrically connected to the substrate. A ball grid array is on the substrate and on the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.