Semiconductor package having an exposed heat spreader
US6552428B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 12, 1999 |
| Grant date | Apr 22, 2003 |
| Priority date | — |
| Expiry date | Oct 12, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package with an exposed heat spreader includes a substrate having a semiconductor chip adhered to a first surface of the substrate. The heat spreader includes an upper portion, a lower portion with an opening formed in the center for receiving the semiconductor chip, and a connecting portion for connecting the upper portion and the lower portion in a manner that the upper portion is raised to a height above the opening of the lower portion. The lower portion is formed with a plurality of positioning members outwardly extending from edges of the lower portion to prevent the heat spreader from being dislocated during a molding process, and further includes downward flutes formed on the periphery of the opening for enabling resin flow underneath the heat spreader. The upper portion of the heat spreader is exposed to an exterior of the semiconductor package to improve heat dissipation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.