Chen Wang
4Patents
1h-index
10Co-inventors
37Inventor score
Filing activity: Aug 4, 2008 → May 6, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7670950B2 | Copper metallization of through silicon via | Electricity | 33 | Active |
| US10103029B2 | Process for filling vias in the microelectronics | Electricity | 1 | Active |
| US10221496B2 | Copper filling of through silicon vias | Electricity | 0 | Active |
| US10541140B2 | Process for filling vias in the microelectronics | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.