Chen-Yao Tang
3Patents
1h-index
11Co-inventors
37Inventor score
Filing activity: Mar 21, 2007 → Jan 23, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7795735B2 | Methods for forming single dies with multi-layer interconnect structures and structures formed therefrom | Emerging Cross-Sectional Technologies | 23 | Active |
| US8941211B2 | Integrated circuit using deep trench through silicon (DTS) | Electricity | 1 | Active |
| US9343352B2 | Integrated circuit using deep trench through silicon (DTS) | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.