Cheng-Hung Hu
3Patents
1h-index
7Co-inventors
33Inventor score
Filing activity: Mar 8, 2013 → May 17, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9982338B2 | High-throughput system and method for post-implantation single wafer warm-up | Electricity | 1 | Active |
| US9663854B2 | High-throughput system and method for post-implantation single wafer warm-up | Electricity | 0 | Active |
| US9196452B2 | Methods and apparatus for carbon ion source head | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.