Chenglu Lin
2Patents
0h-index
7Co-inventors
21Inventor score
Filing activity: Jul 10, 2010 → Dec 31, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8633090B2 | Method for forming substrate with buried insulating layer | Electricity | 0 | Active |
| US9299556B2 | Method for preparing semiconductor substrate with insulating buried layer gettering process | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.