Cheonhee Lee
7Patents
4h-index
7Co-inventors
42Inventor score
Filing activity: Oct 23, 2005 → Mar 7, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7691681B2 | Chip scale package having flip chip interconnect on die paddle | Electricity | 7 | Active |
| US7645640B2 | Integrated circuit package system with leadframe substrate | Electricity | 7 | Active |
| US8067823B2 | Chip scale package having flip chip interconnect on die paddle | Electricity | 6 | Active |
| US9134846B2 | Image display apparatus and method of controlling the same | Physics | 4 | Active |
| US9558685B2 | Wall mounting-type flexible display | Physics | 4 | Active |
| US9049490B2 | Image display apparatus and control method thereof | Electricity | 2 | Active |
| US8174120B2 | Integrated circuit package system with leadframe substrate | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.