Chia-Ho Chen
16Patents
3h-index
23Co-inventors
60Inventor score
Filing activity: Oct 10, 1989 → Nov 28, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4971200A | Packaging system for string lights | Performing Operations; Transporting | 20 | Expired |
| US8896136B2 | Alignment mark and method of formation | Electricity | 9 | Active |
| US9234278B2 | CVD conformal vacuum/pumping guiding design | Chemistry; Metallurgy | 3 | Active |
| US9741575B2 | CVD apparatus with gas delivery ring | Mechanical Engineering; Lighting; Heating | 3 | Active |
| US9543125B2 | Directing plasma distribution in plasma-enhanced chemical vapor deposition | Electricity | 2 | Active |
| US8902561B2 | Electrostatic chuck with multi-zone control | Electricity | 2 | Active |
| US9490209B2 | Electro-migration barrier for Cu interconnect | Electricity | 2 | Active |
| US9478480B2 | Alignment mark and method of formation | Electricity | 2 | Active |
| US9218998B2 | Electrostatic chuck with multi-zone control | Electricity | 1 | Active |
| US8884526B2 | Coherent multiple side electromagnets | Electricity | 1 | Active |
| US10163795B2 | Electro-migration barrier for Cu interconnect | Electricity | 0 | Active |
| US11923304B2 | Electro-migration barrier for interconnect | Electricity | 0 | Active |
| US8916480B2 | Chemical vapor deposition film profile uniformity control | Chemistry; Metallurgy | 0 | Active |
| US10867920B2 | Electro-migration barrier for Cu interconnect | Electricity | 0 | Active |
| US9287154B2 | UV curing system for semiconductors | Electricity | 0 | Active |
| US11515255B2 | Electro-migration barrier for interconnect | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.