Inventor · Tainan, TW

Chien-Ming Chiu

7Patents
3h-index
19Co-inventors
50Inventor score

Filing activity: Mar 30, 2010 → Apr 12, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US8466059B2 Multi-layer interconnect structure for stacked dies Electricity 24 Active
US8896136B2 Alignment mark and method of formation Electricity 9 Active
US8841773B2 Multi-layer interconnect structure for stacked dies Electricity 3 Active
US9478480B2 Alignment mark and method of formation Electricity 2 Active
US10127883B2 Frame rate control method and image processing apparatus selectively limiting frame rate Physics 1 Active
US12147811B2 Warp scheduling method for adjusting number of schedulable warps based on load/store unit stall cycle proportion Textiles; Paper 0 Active
US10867963B2 Die stack structure and method of fabricating the same Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.