Chihwei Lin
3Patents
3h-index
5Co-inventors
36Inventor score
Filing activity: Jul 6, 2005 → Dec 29, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7911044B2 | RF module package for releasing stress | Electricity | 12 | Active |
| US7176567B2 | Semiconductor device protective structure and method for fabricating the same | Electricity | 7 | Expired |
| US7416920B2 | Semiconductor device protective structure and method for fabricating the same | Electricity | 5 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.