Semiconductor device protective structure and method for fabricating the same
US7176567B2 · kind B2 · utility
7Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2005 |
| Grant date | Feb 13, 2007 |
| Priority date | — |
| Expiry date | Jul 6, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a semiconductor device protective structure. The structure comprises a die with contact metal balls formed thereon electrically coupling with a print circuit board. A back surface of the die is directly adhered on a substrate and a first buffer layer is formed on the substrate. The substrate is configured over a second buffer layer such that the second buffer layer substantially encompasses the whole substrate to decrease damage to the substrate when the side of the substrate is collided with an external object.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.