Chilwoo KWON
3Patents
1h-index
10Co-inventors
34Inventor score
Filing activity: Nov 22, 2019 → Feb 24, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10985091B2 | Semiconductor package | Electricity | 1 | Active |
| US11264339B2 | Method of manufacturing connection structure of semiconductor chip and method of manufacturing semiconductor package | Electricity | 0 | Active |
| US11728283B2 | Package substrate and semiconductor package including the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.