Ching-Ying Lee
8Patents
6h-index
7Co-inventors
48Inventor score
Filing activity: Apr 28, 1995 → Aug 10, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5849640A | In-situ SOG etchback and deposition for IMD process | Electricity | 34 | Expired |
| US5591672A | Annealing of titanium - titanium nitride in contact hole | Electricity | 27 | Expired |
| US5552340A | Nitridation of titanium, for use with tungsten filled contact holes | Electricity | 20 | Expired |
| US6008137A | Pattern formation of silicon nitride | Electricity | 9 | Expired |
| US5922622A | Pattern formation of silicon nitride | Electricity | 9 | Expired |
| US5846880A | Process for removing titanium nitride layer in an integrated circuit | Electricity | 6 | Expired |
| US6107201A | Aluminum spiking inspection method | Electricity | 4 | Expired |
| US6446252B1 | Photomask method for making the same capacitor cell area near outmost cell arrays | Physics | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.