Inventor · Zhubei City, TW

Chiu-pien KUO

2Patents
1h-index
6Co-inventors
27Inventor score

Filing activity: Apr 2, 2014 → Sep 24, 2014

Most-cited inventions

PatentTitleAreaCited byStatus
US9653320B2 Methods for etching a hardmask layer for an interconnection structure for semiconductor applications Electricity 4 Active
US9960052B2 Methods for etching a metal layer to form an interconnection structure for semiconductor applications Electricity 1 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.