Christopher Bahr
4Patents
1h-index
7Co-inventors
37Inventor score
Filing activity: Dec 29, 2005 → Nov 14, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7517788B2 | System, apparatus, and method for advanced solder bumping | Electricity | 2 | Active |
| US10651160B2 | Low profile integrated package | Electricity | 0 | Active |
| US7790598B2 | System, apparatus, and method for advanced solder bumping | Electricity | 0 | Active |
| US11407977B2 | Tissue scaffolds for electrically excitable cells | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.