System, apparatus, and method for advanced solder bumping
US7517788B2 · kind B2 · utility
2Cited by
6References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2005 |
| Grant date | Apr 14, 2009 |
| Priority date | — |
| Expiry date | Sep 19, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0577
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
According to some embodiments, a method, apparatus, and system are provided. In some embodiments, the method includes providing solder resist material on a surface of a substrate, applying mask material on top of the solder resist material, reflowing solder located in an opening formed through both the solder resist material and the mask material, and removing the mask material after the reflowing of the solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.