Chung-Bin Tseng
11Patents
1h-index
16Co-inventors
47Inventor score
Filing activity: Jun 28, 2013 → Jul 25, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10269684B2 | Semiconductor structure and manufacuting method of the same | Electricity | 2 | Active |
| US10163646B2 | Method for forming semiconductor device structure | Electricity | 1 | Active |
| US11430909B2 | BSI chip with backside alignment mark | Electricity | 1 | Active |
| US9691809B2 | Backside illuminated image sensor device having an oxide film and method of forming an oxide film of a backside illuminated image sensor device | Electricity | 1 | Active |
| US9831154B2 | Semiconductor structure and manufacuting method of the same | Electricity | 1 | Active |
| US9583356B1 | Method for forming semiconductor device structure | Electricity | 1 | Active |
| US10056316B2 | Manufacuting method of semiconductor structure | Electricity | 0 | Active |
| US10665466B2 | Method for forming semiconductor device structure | Electricity | 0 | Active |
| US12094997B2 | BSI chip with backside alignment mark | Electricity | 0 | Active |
| US10008530B2 | Image sensing device and manufacturing method thereof | Electricity | 0 | Active |
| US10658269B2 | Semiconductor structure and manufacturing method of the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.