Cing-He Chen
2Patents
1h-index
7Co-inventors
33Inventor score
Filing activity: Mar 15, 2013 → Jul 29, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8945983B2 | System and method to improve package and 3DIC yield in underfill process | Electricity | 3 | Active |
| US11728238B2 | Semiconductor package with heat dissipation films and manufacturing method thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.