Semiconductor package with heat dissipation films and manufacturing method thereof
US11728238B2 · kind B2 · utility
0Cited by
27References
21Claims
0Family size
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Key dates
| Filing date | Jul 29, 2019 |
| Grant date | Aug 15, 2023 |
| Priority date | — |
| Expiry date | Jul 29, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a redistribution structure, at least one semiconductor device and a plurality of heat dissipation films. The at least one semiconductor device is mounted on the redistribution structure. The plurality of heat dissipation films are disposed on the at least one semiconductor device in a side by side manner and jointly cover an upper surface of the at least one semiconductor device. A manufacturing method of the semiconductor package is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.