System and method to improve package and 3DIC yield in underfill process
US8945983B2 · kind B2 · utility
3Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2013 |
| Grant date | Feb 3, 2015 |
| Priority date | — |
| Expiry date | Mar 15, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method embodiment includes forming a packaging unit by attaching a die to a packaging substrate, applying plasma treatment to a first portion of the packaging substrate, wherein the first portion corresponds to a portion of the packaging substrate underneath the die, not applying plasma treatment to a second portion of the packaging substrate, wherein the second portion of the packaging substrate surrounds the first portion of the packaging substrate, and applying an underfill material over the first portion of the packaging substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.