Colin B. Bosch
2Patents
2h-index
8Co-inventors
27Inventor score
Filing activity: Jun 1, 1998 → Jun 1, 1998
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6300679A | Flexible substrate for packaging a semiconductor component | Electricity | 163 | Expired |
| US6093583A | Semiconductor component and method of manufacture | Electricity | 8 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.