Semiconductor component and method of manufacture
US6093583A · kind A · utility
8Cited by
4References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 1998 |
| Grant date | Jul 25, 2000 |
| Priority date | — |
| Expiry date | Jun 1, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12044
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a semiconductor component includes applying an encapsulant (211) to a wafer (210, 430), degassing the encapsulant (211), and separating the wafer (210, 430) into a plurality of semiconductor components. Manufactured in this manner, the encapsulant (211) of the semiconductor component is substantially devoid of air bubbles and voids.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.