Flexible substrate for packaging a semiconductor component
US6300679A · kind A · utility
163Cited by
31References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 1998 |
| Grant date | Oct 9, 2001 |
| Priority date | — |
| Expiry date | Jun 1, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/189
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor component includes a semiconductor chip (341, 502, 601, 701, 1101, 1410, 1501) having first and second surfaces opposite each other, a semiconductor device (301) in the semiconductor chip (341, 502, 601, 701, 1101, 1410, 1501), and a flexible substrate (120, 401, 510, 610, 710, 1000, 1050, 1300, 1401, 1510, 1520) packaging the semiconductor chip (341, 502, 601, 701, 1101, 1410, 1501).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.