Cuong Le
7Patents
5h-index
7Co-inventors
56Inventor score
Filing activity: Apr 7, 2000 → Mar 10, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6407546B1 | Non-contact technique for using an eddy current probe for measuring the thickness of metal layers disposed on semi-conductor wafer products | Physics | 58 | Expired |
| US6741076B2 | Eddy current measuring system for monitoring and controlling a CMP process | Physics | 16 | Expired |
| US6549006B2 | Eddy current measurements of thin-film metal coatings using a selectable calibration standard | Physics | 15 | Expired |
| US6762604B2 | Standalone eddy current measuring system for thickness estimation of conductive films | Physics | 15 | Expired |
| US7019519B2 | Thickness estimation using conductively related calibration samples | Physics | 7 | Expired |
| US11744913B2 | Fluid conduit disinfector | Performing Operations; Transporting | 0 | Active |
| US11747008B2 | Deep ultraviolet light source | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.