Daisuke Kishimoto
6Patents
4h-index
20Co-inventors
57Inventor score
Filing activity: May 19, 1986 → Mar 8, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7029977B2 | Fabrication method of semiconductor wafer | Electricity | 26 | Expired |
| US4767516A | Method for making magnetic recording media | Physics | 19 | Expired |
| US7821014B2 | Semiconductor device and manufacturing method thereof with a recessed backside substrate for breakdown voltage blocking | Electricity | 8 | Active |
| US7355257B2 | Semiconductor superjunction device | Electricity | 8 | Active |
| US7510975B2 | Method for manufacturing a semiconductor device having trenches defined in the substrate surface | Electricity | 4 | Active |
| US5715358A | Method for recording at least two picture signals and method of reproduction at least two picture signals | Electricity | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.