Lead-free solder
US7282175B2 · kind B2 · utility
18Cited by
2References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 15, 2004 |
| Grant date | Oct 16, 2007 |
| Priority date | — |
| Expiry date | Sep 10, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/36
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A lead-free solder includes 0.05-5 mass % of Ag, 0.01-0.5 mass % of Cu, at least one of P, Ge, Ga, Al, and Si in a total amount of 0.001-0.05 mass %, and a remainder of Sn. One or more of a transition element for improving resistance to heat cycles, a melting point lowering element such as Bi, In, or Zn, and an element for improving impact resistance such as Sb may be added.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.