Daniel Lau
5Patents
4h-index
10Co-inventors
50Inventor score
Filing activity: Sep 23, 2003 → Nov 27, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7259445B2 | Thermal enhanced package for block mold assembly | Electricity | 74 | Expired |
| US7563648B2 | Semiconductor device package and method for manufacturing same | Electricity | 15 | Expired |
| US7247933B2 | Thin multiple semiconductor die package | Electricity | 8 | Expired |
| US7489021B2 | Lead frame with included passive devices | Emerging Cross-Sectional Technologies | 8 | Expired |
| US10902026B2 | Block classified term | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.