Lead-free solder paste as thermal interface material
US11581239B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2020 |
| Grant date | Feb 14, 2023 |
| Priority date | — |
| Expiry date | Mar 25, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/42
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Some implementations of the disclosure are directed to a thermal interface material. In some implementations, a method comprises: applying a solder paste between a surface of a heat generating device and a surface of a heat transferring device to form an assembly; and reflow soldering the assembly to form a solder composite, wherein the solder composite provides a thermal interface between the heat generating device and the heat transferring device, wherein the solder paste comprises: a solder powder; particles having a higher melting temperature than a soldering temperature of the solder paste, wherein the solder paste has a volume ratio of solder powder to high melting temperature particles between 5:1 and 1:1.5; and flux.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.