David Crouthamel
3Patents
2h-index
5Co-inventors
30Inventor score
Filing activity: Mar 14, 2006 → May 2, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7982307B2 | Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate | Electricity | 5 | Active |
| US7479695B2 | Low thermal resistance assembly for flip chip applications | Electricity | 2 | Active |
| US7671436B2 | Electronic packages | Electricity | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.